Projects
![[Translate to English:] VerGaN](/fileadmin/data/iue/organisationundpersonen/mechatronik/avt/1.png)
Research into integration technologies for vertical power transistors based on gallium nitride
As part of the project, HAW-Kiel is responsible for packaging the novel GaN semiconductors into a power module and investigating the potential applications of these power modules. The main focus of the project is top-side contacting of the GaN semiconductors. To effectively dissipate power loss from the module, a cooling system is also being developed by HAW-Kiel and designed to meet the specific requirements. The bonding and joining technology (AVT) required for module construction is being evaluated for its suitability for GaN semiconductors in order to develop the necessary technical joining processes.
Duration: 01.02.2024 - 31.01.2028
Grant amount: 2.800.000 €
![[Translate to English:] CuTech](/fileadmin/data/iue/organisationundpersonen/mechatronik/avt/2.png)
The “Cu-Tech” project aims to develop a new large-area bonding technology for power electronics modules. We replace the solder currently in use with a sintered copper bond. This creates a bonding layer that is technically, environmentally, and economically superior. Sintered copper pastes offer better thermal conductivity, higher mechanical stability, and a longer service life than conventional solder joints.
Duration: 01.06.2025 - 31.05.2028
Grant amount: 430.987,00 €
![[Translate to English:] LaGan Forschungsprojekt](/fileadmin/data/iue/organisationundpersonen/mechatronik/avt/lagan-bild.png)
The research project “Power Electronics and Application-Oriented Operation of Energy-Efficient Gallium Nitride Power Semiconductors in the Vehicle-Related Energy Conversion Chain” at Kiel University of Applied Sciences aims to develop gallium nitride (GaN) technology for energy conversion in future electric vehicles with 800-volt battery voltages. The focus is on highly efficient stationary and onboard charging systems. The goal is to develop innovative power cores that save space and maximize efficiency through the use of GaN. Modular building-block concepts and production-ready assembly technologies are intended to reduce system costs and ensure scalability for mass production. In this way, LaGaN creates the technological foundation for competitive fast charging in the next generation of vehicles.
Duration: 01.06.2024 - 31.05.2027
Grant amount: 1.034.000 €
![[Translate to English:] SPC](/fileadmin/data/iue/organisationundpersonen/mechatronik/avt/3.png)
The Interreg project aims to develop highly integrated and intelligent power electronics modules for variable power requirements in modern energy and smart home systems. Our primary focus is on the development of two demonstrators: a technological test module for validating advanced bonding, joining, and lamination technologies, and a three-phase power module. Another research focus is on increasing the moisture resistance of laminated modules.
Duration: 01.06.2023 - 31.05.2026
Grant amount: 1.637.794 €
“Development of sintering processes for the fabrication of aluminum heat sinks” as part of the collaborative project “Corrosion-Resistant Fabrication and Joining Technologies for Power Electronics”
For electric vehicles of all types, the drive electronics are a key component. So-called direct liquid-cooled power modules are used for the drive power. Copper coolers with copper water cooling fins represent the state of the art for effective cooling performance. However, a new phenomenon arises here: contact corrosion between the water-cooled drive motor with its aluminum stator and the copper-cooled power module located in the same cooling circuit.
This corrosion-induced degradation process is to be addressed in the overall KoKo-Power project. To this end, this subproject will develop a concept and design for drive electronics (power half-bridge) suitable for corrosion-resistant use in electric vehicles, utilizing aluminum heat sinks. The goal is a drive module realized using water-contacting, 3D-structured aluminum elements and a ceramic substrate via low-temperature sintering based on silver. This replaces the traditional copper heat sink with an aluminum body.
The technical goal is an all-in-one sintering step in which the semiconductor, the ceramic substrate, and the aluminum heat sink are joined together. This development largely prevents corrosion- and mechanically-induced damage, resulting in cost-optimized, robust, and high-performance drive electronics. To achieve this, both a suitable sintering machine and all design.
Grant amount: 441.441,00 €
Duration: 01.05.2021 bis 30.04.2024
![[Translate to English:] Avel Power Modul HAW Kiel](/fileadmin/data/iue/organisationundpersonen/mechatronik/avt/_mg_6588.jpg)
The core objective of the project is to research new inorganic potting compounds for use in electric drive systems. Such materials promise increased thermal conductivity combined with good insulation properties. This will enable the economic goals of miniaturizing cost-sensitive components to be achieved. At the same time, this results in a longer range for battery-electric vehicles due to the reduced weight. This involves a new class of materials for the encapsulation of power electronics and electric machines with significantly better thermal properties than the plastic-based encapsulants used to date, which is to be developed as a universal material for the target application. The research results on materials, mechatronics, and process technology are to be demonstrated and evaluated in a highly integrated prototype drive for automotive applications. In parallel, the technology will also be transferred to an industrial drive, paving the way for broader market deployment. In this project, Kiel University of Applied Sciences is responsible for applying the encapsulant within the system and on the power modules, as well as conducting subsystem tests.
Grant amount: 961.372 €
Duration: 01.09.2021 – 28.02.2025
Low-inductance SiC power module with an organic insulating film
- Laminated copper lead frames with an organic insulating layer
- SiC MOSFETs (1200 V) with a die-top system
- Direct lamination onto the heat sink
- Circuit layout: half-bridge
- Multi-layer structure to reduce inductance with a third layer: 3.6 nH at 10 MHz
- ShowerPower 3D cooling structure for highly efficient heat dissipation
- Two heat sink half-shells form a common heat sink block
Project Type: Bachelor’s Semester Project
The Liteplacer project involves modifying a Liteplacer—currently configured as a “pick-and-place” machine—so that it can measure sintered contacts. The Liteplacer is equipped with a camera that uses AI to recognize the contacts, automatically align itself, lower, and perform a measurement. As power modules—and thus the contacts—continue to shrink in size, it becomes significantly more difficult to measure the contacts by hand. Such a machine can therefore perform the necessary measurements more easily and quickly.