Bonding and Joining Technology

The laboratory for bonding and joining technology focuses on the development, analysis, and optimization of modern joining technologies for electronic power devices. The goal is to improve the long-term electrical, thermal, and mechanical performance of modules through innovative and energy-efficient assembly concepts as well as tailored, sustainable manufacturing processes.

• Behrendt-Bicakci, Prof. Dr.-Ing. Aylin

Our laboratories offer the opportunity to turn new concepts into functional prototypes. Designs can be implemented and tested in-house under realistic conditions, utilizing modern manufacturing techniques such as sintering, vaccum brazing, wire bonding and various encapsulation methodes.This way we can ensure a direct connection between the theoretical development and the practical application.

We accompany innovations and solutions every step from the concept to the functional implementation. The production process and testing of prototypes reveals practical insights on materials, processes, and structures in real world conditions.These insights contribute to fundamental research aswell as industry relevant applications, enabeling the successfull development of high-performance electronic systems.

Kontakt, Anfahrt, Lagepläne