Bonding and Joining Technology

The Institute for bonding and joining technology focuses on the development, analysis, and optimization of modern joining technologies for electronic power devices. The goal is to improve the long-term electrical, thermal, and mechanical performance of modules through innovative and energy-efficient assembly concepts as well as tailored, sustainable manufacturing processes.

• Behrendt-Bicakci, Prof. Dr.-Ing. Aylin

Our laboratories offer the opportunity to turn new concepts into functional prototypes. Using modern manufacturing techniques such as sintering, vacuum brazing, wire bonding, and encapsulation, designs can be implemented and tested under realistic conditions. This creates a direct link between theoretical development and practical application.

At our institute, new approaches are not only conceived but also supported through every stage of development until they are fully functional. The production and testing of prototypes enable a practical evaluation of materials, processes, and structures under real-world operating conditions. This makes a key contribution the further development of high-performance electronic systems, from basic research to industry-relevant applications.

You can find us in the building  C12-3.28.

Kontakt, Anfahrt, Lagepläne