News
HAW Kiel at PCIM Expo 2026
![[Translate to English:] I love PCIM](/fileadmin/_processed_/1/5/csm_pxl_20250507_065102018.portrait_1__82706c345b.jpg)
The Assembly and Connection Technology team is ready to go.
The bonding an joining (AVT) team is getting ready for the trip to Nürnberg: From May 19 to 21, 2026, we will represent our university at PCIM Expo, the leading trade fair for power electronics.
This marks a first: For the first time, our team will present itself to the international professional audience under the new name HAW Kiel (formerly FH Kiel), and we will also be represented with two publications at the poster session.
Visit us in Hall 6 at Booth 133. Our experts look forward to personal exchanges, networking with industry partners, and engaging conversations with alumni and interested visitors. See you in Nürnberg!
15 million euros for the new “Schleswig-Holstein Power Electronics Application Center” (LEA.SH)
Schleswig-Holstein is investing up to 15.28 million euros in the new “Schleswig-Holstein Power Electronics Application Center” (LEA.SH) on the campus of Kiel University of Applied Sciences. The project is primarily funded by EU and state funds. The center brings together cutting-edge research, commercial applications, and technology transfer in the field of power electronics—a key technology for the energy transition, electromobility, and grid stability. Among other things, the LEA.SH will house Prof. Dr. Aylin Behrendt-Bicakci’s Laboratory for Assembly and Interconnection Technology. With this project, Schleswig-Holstein is strengthening its role as a hub for innovation and the energy transition and setting an important milestone on the path to a climate-neutral industry.
Merry Christmas!
![[Translate to English:] HAW Kiel Aufbau und Verbindungstechnik Weihnachtsgruss](/fileadmin/_processed_/d/a/csm_plaetzchenblech_e76710e4f0.jpg)
As the year comes to a close, we would like to extend our heartfelt thanks to all students, staff, project partners, and supporters. Your dedication, curiosity, and excellent collaboration have shaped the past year and made it a success.
We wish you and your families a peaceful Christmas season, restful holidays, and good health and renewed energy for the coming year. May 2026 bring many exciting projects, innovative ideas, and shared successes.
Merry Christmas and a happy New Year!
Your team at
Bonding and Joining Lab
HAW Kiel
The North knows power electronics!
This remark by Robert Plikat (Volkswagen Group) at the 2nd Symposium on Power Electronics at the University of Applied Sciences (HAW Kiel) left a lasting impression on many of the nearly 100 attendees.
Many thanks to all the speakers for their numerous contributions on various aspects of power electronics, and special thanks to Aylin Bicakci and Dr. Andreas Borchardt for organizing this successful conference.
We are already looking forward to next year!
2nd Symposium on Power Electronics
![[Translate to English:] Fachtagung Leistungselektronik](/fileadmin/data/iue/organisationundpersonen/mechatronik/avt/screenshot_2025-11-26_144157.jpg)
04.12.2025 08:30 - 18:00
Location: C18 Audimax
Invitation to the 2nd Symposium on Power Electronics at Kiel University of Applied Sciences
Gain in-depth insights into the latest research findings and technological developments across the entire power electronics value chain—from novel materials and advanced integration technologies to system approaches for future applications. Take advantage of this opportunity to engage in professional exchange with experts from industry, academia, and applied research. Presentations from ongoing projects as well as contributions from early-career researchers will also provide practical insights into application-oriented solutions.
Program
2nd Symposium on Power Electronics (PDF)
Eine Anmeldung ist erforderlich:
https://pretix.eu/fh-kiel/Power25/
Exhibiting at PCIM Europe 2026
![[Translate to English:] Messestand](/fileadmin/data/iue/organisationundpersonen/mechatronik/avt/messestand.png)
Participation in the international industry event:
From June 9 to 11, 2026, PCIM Europe, the world’s leading trade fair and conference for power electronics, will take place in Nuremberg. We will once again have our own booth—an opportunity to present our research findings to a national and international audience of industry professionals.
- A firsthand look at current research projects in our field—live and on-site.
- An opportunity for professional exchange with students, research staff, and developers.
- Networking with stakeholders from industry and academia—and identifying research and development opportunities.
![[Translate to English:] neu](/fileadmin/_processed_/e/6/csm_neu_e2e7c8ac9f.png)
Type of work: Project or master’s thesis
Title: Thermal comparison of a bolted connection for a power electronics module’s heat sink attachment
Contact: Prof. Dr. Bicakci or Yannick Bockholt
Start date: Available immediately!
Topic description:
Modern power electronics modules are often screwed to a cooling system at several corner points with thermal paste in between. This project will investigate an approach that evaluates the thermal structure of the module for screw-on modules (an external thread for an entire module). The contact surface created by the screw connection can offer thermal advantages.
Task description:
Thermal simulation using SolidWorks Flow Simulation Design and construction of comparable test specimens Examination and measurement of test specimens
Type of work: Project or master’s thesis
Contact: Prof. Dr. Bicakci or Yannick Bockholt
Start date: Available immediately!
Topic description:
Modern power electronics modules are often bolted to a cooling system at several corners using thermal paste as an intermediate layer. This project will investigate an approach that evaluates the thermal structure of the module for bolted modules (a single external thread for the entire module). The contact surface created by the bolting can offer thermal advantages.
Task description:
Thermal simulation using SolidWorks Flow Simulation; design and construction of a cooling system for screw-mounted modules; manufacturing and commissioning of the cooling system; measurement tests for multiple variations
Type of work: Project work
Contact person: Prof. Dr. Bicakci or Jesco Beyer
Start date: Available immediately!
Project description: In the context of developing power electronics assemblies, new technologies are constantly being tested for teaching and research purposes. The tool head to be developed is intended to serve as the basis for top-side contacting of semiconductors and substrates in order to meet the trend toward ever-smaller installation spaces.
Task description: Design and implementation of a tool head for an existing near-production placement machine using rapid prototyping (3D printing). This tool head should be capable of placing multiple pins onto a substrate simultaneously.
Type of work: Project work or bachelor’s thesis
Contact: Prof. Dr. Bicakci or Jesco Beyer
Start date: Available immediately!
Topic description: The latest generation of fast-switching semiconductors (SiC or GaN semiconductors) require very short and symmetrical gate connections. Therefore, known package types (e.g., econo-type) are of limited use. A bridge structure (3D printing) could allow contact pins to be placed directly on the semiconductor, thereby representing an upgrade of this package class for future wide-bandgap applications
Task description: CAD design of various bridges and support structures for econo module frames; fabrication via SLS 3D printing; integration and testing on suitable assemblies