News

Type of work: Project or master’s thesis

Contact: Prof. Dr. Bicakci or Yannick Bockholt

Start date: Available immediately!

Topic description:

Modern power electronics modules are often bolted to a cooling system at several corners using thermal paste as an intermediate layer. This project will investigate an approach that evaluates the thermal structure of the module for bolted modules (a single external thread for the entire module). The contact surface created by the bolting can offer thermal advantages.

Task description:

Thermal simulation using SolidWorks Flow Simulation; design and construction of a cooling system for screw-mounted modules; manufacturing and commissioning of the cooling system; measurement tests for multiple variations

Type of work: Project work

Contact person: Prof. Dr. Bicakci or Jesco Beyer

Start date: Available immediately!

Project description: In the context of developing power electronics assemblies, new technologies are constantly being tested for teaching and research purposes. The tool head to be developed is intended to serve as the basis for top-side contacting of semiconductors and substrates in order to meet the trend toward ever-smaller installation spaces.

Task description: Design and implementation of a tool head for an existing near-production placement machine using rapid prototyping (3D printing). This tool head should be capable of placing multiple pins onto a substrate simultaneously.

Type of work: Project work or bachelor’s thesis

Contact: Prof. Dr. Bicakci or Jesco Beyer

Start date: Available immediately!

Topic description: The latest generation of fast-switching semiconductors (SiC or GaN semiconductors) require very short and symmetrical gate connections. Therefore, known package types (e.g., econo-type) are of limited use. A bridge structure (3D printing) could allow contact pins to be placed directly on the semiconductor, thereby representing an upgrade of this package class for future wide-bandgap applications

Task description: CAD design of various bridges and support structures for econo module frames; fabrication via SLS 3D printing; integration and testing on suitable assemblies

Type of work: Project work

Contact person: Prof. Dr.-Ing. Bicakci or Christian Hennig

Start date: Available immediately!

Project description: In power electronics, silicones are used, among other materials, as potting compounds. They offer high dielectric strength, which in turn ensures a safe circuit design. However, silicones absorb moisture through thermal processes and humidity. This moisture can result in a change in dielectric strength. In this project, a moisture-resistant shield will be selected and investigated to compare encapsulated and open silicone in terms of moisture penetration.

Task Description:

• Design and selection of measurement methodology
• Design and construction of test specimens
• Development of measurement electronics for test specimens
• Measurement of test specimens to analyze functionality
• Investigation of the influence of moisture-resistant layers on the silicone potting of a power electronics module

Type of work: Project or thesis

Contact person: Prof. Dr. Bicakci or Yannick Bockholt 

Start date: Available immediately!

Topic description: The thermal conductivity of materials plays a crucial role in power electronics for module cooling. Reliable thermal conductivity values are often lacking, particularly when using alternative or new materials. This can lead to significant deviations from reality in simulations. To prevent this, thermal conductivity is determined in the analytical laboratory

Task description:

• Determination of contact resistances
• Identification of suitable thermal interface materials
• Design and implementation of a software solution for contact resistance-corrected measurements
• Measurement of highly conductive samples

Type of project: Project work or thesis

Type of project: Project work or thesis

Contact person: Prof. Dr. Bicakci or Bennet Lorbeer

Start date: Available immediately!

Project description: In industrial electronics manufacturing processes, pick-and-place processes are used to position individual components on a printed circuit board. This is also used in the placement of semiconductors for silver sintering processes. In this process, a heating plate is used to make the silver sintering paste already applied to the printed circuit board “sticky,” so that the semiconductors adhere to it. Due to the influence of heat, ceramic printed circuit boards such as DCBs and AMBs in particular can warp. To counteract this warping, a hold-down device must be developed that can be activated and deactivated from outside the Tresky placement system.

Task Description:

• Design and construction of a hold-down device within the Tresky system’s installation space
• Integrate electrical or pneumatic activation
• Develop a simple test procedure to evaluate the solution